교내채용

구분 근무형태 경력 기업형태 성별 지역 직종
일반공고 정규직 신입 기타 무관 충청남도 기계·제조·생산관리,

모집요강

회사소개

당사 는 세계적인 반도체 장비 제조회사인 ASM의 한국자회사로 ALD system의 개발 과 생산 및 국내 반도체 회사인 삼성전자, 하이닉스 반도체, 실트론, 동부 아남 반도체, 페어차일드 코리아 등 국내 유수의 반도체 사업체에 반도체 장비를 판매 , 유지 보수 업무를 수행 하고 있습니다.

Atomic Layer Deposition, ALD 란

반도체 제조 공정 중 화학적으로 달라붙는 단원자층의 현상을 이용한 나노 박막 증착기술. 웨이퍼 표면에서 분자의 흡착과 치환을 번갈아 진행함으로 원자층 두께의 초미세 층간(layer-by-layer) 증착이 가능하고, 산화물과 금속박막을 최대한 얇게 쌓을 수 있으며, 가스의 화학반응으로 형성된 입자들을 웨이퍼 표면에 증착시키는 화학 기상 증착(CVD)보다 낮은 온도(500도 이하)에서 막질을 형성할 수 있어 시스템온칩(SoC) 제조에 적합하다.

첨단기술분야의 종주국으로서 우리나라는 핵심기술을 외국에 수출하는 선도적인 위치에 있습니다.

- 설립 : 1996년 2월

- 회사 주소 : 충남 천안시

- 직원 수 : 125 명

- 매출액 : 2,109억원, 손익 : 211 억원, 자본금 306 억원

1. 모집부문 및 자격조건

부서	모집부문	직무소개 & 자격요건	근무지
R&D	Mechanical Engineer	하기 참조	천안
R&D	Electrical Engineer	하기 참조	천안
R&D	Process Engineer	하기 참조	천안
R&D	Software Engineer	하기 참조	천안

Mechanical Engineer

[Job Description]

• Apply engineering principles, product specifications and research data to create designs for systems and products for semiconductor industry.

• Perform engineering calculations, including engineering analysis and finite element analysis, for thermal, mechanical, heat transfer and fluid dynamics problems.

• Perform the modeling, design and drawing using Pro/ENGINEER and AutoCAD.

• Determine feasibility of product proposals, resolve problems based on technical inputs and develop new designs based on the same, maintaining product design safety criteria.

• Prepare product/system designs and related engineering documentation for the manufacturing and testing of prototype and production released products.

• Project management duties include report generation, schedule management and design reviews.

• Create, manage and execute engineering project plans, including task scheduling with Gantt charts and resource and cost estimates, using MS Project.

• Support projects in conjunction with technical staff, managers and manufacturing groups. Support development and testing of hardware to verify performance.

• Evaluate change requests and complete all aspects of engineering change orders.

[Requirements]

• Ability to design, develop and integrate system level mechanical features and functions, including configuration control aspects.

• Able to direct/work with a diverse group of people to achieve requirements and specifications on complex projects.

• Knowledgeable in the requirements for CE, SEMI S2, S8, F14 and other relevant standards as applicable to semiconductor manufacturing equipment.

• Ability to create, check, review and analyze mechanical designs, test procedures and equipment specifications.

• Effective communications skills.

• Understanding of materials: metals, plastics, quartzware graphite heat transfer, surface coatings and surface finishes.

• Computer background in Microsoft applications, AutoCAD and Pro/ENGINEER.

• Proficiency in ANSI Y14.5 (ISO, KS) including geometric tolerancing

[Education]

• BS or MS degree in mechanical engineering or related degree(s) preferred.

Electrical Engineer

[Job Description]

• Electrical design of Semiconductor wafer processing equipment.

- Drawing of electrical schematic drawing by AutoCAD.

- Create BOM of electrical component.

- Design the PCB.

- Define the system IO structure.

- Design the electrical rack system and component layout of the frame.

- Calculate the engineering data such as power conception.

• Safety and Failure analysis and design the safety interlock system.

• Provide Customer Service departments with engineering support in resolving field problems.

• Evaluate engineering change requests and implement changes.

• Provide technical support for capital orders, expense projects, retrofits and development projects.

• Apply product specifications and research data to create designs for systems and products for the semiconductor industry maintaining code compliance and product design safety criteria.

• Direct and coordinate manufacturing, construction, installation, maintenance, support, documentation, and testing activities to ensure compliance with specifications, codes, and customer requirements.

[Requirements]

• Should have a broad based background in analysis, design and debug of complex electrical and electronic systems.

• Well versed with the requirements of CE, NEC , IEC, NFPA, VDE , SEMI S2-95 and other relevant standards as applicable to semiconductor manufacturing equipment.

• Experience in the Microsoft office; Manufacturing Requirements Planning (MRP); AutoCad; OrCad

• Experience in the design of AC/DC power distribution, logic circuits, equipment controls, sensors interface, motion control, pneumatics control and systems integration.

• Experience in the SEMI S2, S8, S22 guidelines, IEC, VDE, CE, NFPA 79, NFPA 70, and UL508A

[Education]

• BS or MS degree in Electrical Engineering

Process Engineer

[Job Description]

• Survey and review the MRS.

• Develop the thin film process base on the MRS.

• Develops innovative solutions and new approaches to technical problems to determine the sequence of processes

• Interact with engineering and marketing to reduce gaps between current and MRS.

• Test process stability of new products and conformance to MRS.

• Test and validate the changes of hardware and software.

• Align customer needs and internal development.

• Perform wafer demo for customer applications.

• Make feedback to development.

• Maintain and operate the demo equipment with best condition.

• Process development on customer site in case of JD project.

• Submit and present papers to international journal related with semiconductor subject.

[Requirements]

• Good documentation and writing abilities

• Understanding of software or system technical testing.

• Ability to read, learn electrical and mechanical schematics

• Ability to use software, learn its operation and identify errors in operation

• Excellent oral and written communications skills.

• Excellent thin film analysis knowledge

• Sound business and organizational skills.

• Ability to quickly understand the “big picture design” and how one change can affect the system.

• A multi-tasking, ambitious team player approach is essential

• ALD or CVD experience in semiconductor chip maker

[Education]

• MS or Ph.D. degree in electronics engineering or related degree(s) preferred.

Software Engineer

[Job Description]

• Semiconductor Equipment Control Software Development

- Scheduler Software

- Process Module Control Software

- Transfer Module Control Software

- Factory Automation - HSMS Protocol

- EDA(Equipment Data Acquisition) Software.

- RS232 or RS485 Serial Communication

- Device Net Communication

- Robot Control Software.

[Requirements]

• Positive people who have a passion for things.

• Harmonious interpersonal relationship.

• Ability of C# and C++ development tool.

• Experience in Semiconductor Equipment Control Software Development.

• Experience in Factory Automation(SEMI E5, E30, E40, E84, E87, E90, E94).

• Experienced in MS Office such as Excel, Word, PowerPoint and Outlook.

• Experience in semiconductor production line, FAB(Fabrication).

[Education]

• Computer engineering, telecommunication engineering, or IT(Information Technology) related major.

2. 모집기간 : 2015년 5월 20일 (수) ~ 2015년 5월 30일 (토)

3. 모집대상 : 전기/전자/반도체/기계/컴퓨터 공학 전공 학,석,박사 졸업자예정자 및 기 졸업자

영어커뮤니케이션 가능자

4. 지원방법

- ①이력서(필수), ② 학교성적증명서(필수), ③자기소개서(선택)를 email로 제출

지원 서류는 반드시 파일 1개로 만들어 제출 요망

- 인사담당자 연락처

. 오재진 이사 (02-2051-3437)

. email : jay@scoutpartners.co.kr

- email 제목은 반드시 “R&D학사/석사/박사-모집부문-성명” 으로 작성

예 : R&D석사-Mechanical Engineer-홍길동

5. 전형절차 : 서류전형 → 1차 면접전형 → 2차 면접전형

최종 합격여부는 모든 전형절차의 결과를 종합하여 결정됩니다

6. 근무지 : 충남 천안시 서북구

국민대학교

채용정보

외국계 반도체 증착장비회사 신입/경력 사원 모집 - 교내채용

모집요강